Lamination - 軟板(FPC)本貼

Cover lay is the structure including a layer of resin and insulator.

So lamination will apply heat and pressure to melt resin and fill the spaces in.

After cover-lay binding tight then FPCBs operation has been completed.

本貼：絕緣覆蓋膜結構包含了一層樹脂及一層絕緣膜。熱壓合則是利用機械提供熱能及壓力，將熔化樹脂填滿線路間縫隙，同時將覆蓋膜與基材緊密貼合，形成完整線路板。

[commericial adverrtising]

• Item:: 46ton Vacuum Laminator
• Temperature:: 120degree C
• Fixture plate size:: 380*560mm(max)
• FPC heating plate:: 20KG/CM2(max)